搜索結(jié)果
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[行業(yè)動(dòng)態(tài)]高壓大功率IGBT模塊首選封裝材料——AMB陶瓷基板
2024-03-18 http://www.nimazhi.cn/Article/gaoyadagonglvIGBTmok.html
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[常見(jiàn)問(wèn)題]不同材質(zhì)的陶瓷基板分別適用哪些拋光工藝?
2024-01-15 http://www.nimazhi.cn/Article/butongcaizhidetaocij.html
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[行業(yè)動(dòng)態(tài)]Si3N4-AMB陶瓷基板的應(yīng)用
2023-11-15 http://www.nimazhi.cn/Article/Si3N4-AMBtaocijiband.html
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[行業(yè)動(dòng)態(tài)]一文搞懂陶瓷基板DPC,AMB,HTCC,DBC等工藝技術(shù)
2023-11-06 http://www.nimazhi.cn/Article/yiwengaodongtaocijib.html
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[行業(yè)動(dòng)態(tài)]陶瓷基板的市場(chǎng)規(guī)模和應(yīng)用發(fā)展
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[行業(yè)動(dòng)態(tài)]陶瓷基板市場(chǎng)預(yù)計(jì)未來(lái)3年大增94.27%,國(guó)產(chǎn)化需求強(qiáng)烈
2023-10-09 http://www.nimazhi.cn/Article/taocijibanshichangyu.html
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[行業(yè)動(dòng)態(tài)]陶瓷基板的市場(chǎng)到底有多大?十億?百億?
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[行業(yè)動(dòng)態(tài)]電子封裝陶瓷基片材料的種類(lèi)
2023-10-04 http://www.nimazhi.cn/Article/taocijipiandezhonglei.html
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[行業(yè)動(dòng)態(tài)]Si3N4-AMB陶瓷基板在高功率半導(dǎo)體器件中的應(yīng)用
2023-08-28 http://www.nimazhi.cn/Article/Si3N4-AMBtaocijibanz.html
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[行業(yè)動(dòng)態(tài)]陶瓷基板助力高功率器件散熱消暑
2023-08-25 http://www.nimazhi.cn/Article/taocijibanzhuligaogo.html
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[行業(yè)動(dòng)態(tài)]2023年AMB陶瓷基板實(shí)力企業(yè)榜單
2023-07-24 http://www.nimazhi.cn/Article/2023nianAMBtaocijiba.html
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[行業(yè)動(dòng)態(tài)]陶瓷基板的市場(chǎng)到底有多大?
2023-07-10 http://www.nimazhi.cn/Article/taocijibandeshichang.html
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[行業(yè)動(dòng)態(tài)]AMB/DBC陶瓷基板超聲SAM檢測(cè)
2023-05-22 http://www.nimazhi.cn/Article/AMBDBCtaocijibanchao.html
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[行業(yè)動(dòng)態(tài)]大功率IGBT功率模塊用氮化鋁覆銅基板
2023-04-17 http://www.nimazhi.cn/Article/dagonglvIGBTgonglvmo.html
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[常見(jiàn)問(wèn)題]銅基板和陶瓷基板有什么區(qū)別呢?
銅基板 陶瓷基板都是具有電氣性能的電路板,都使用在高頻和高溫產(chǎn)品領(lǐng)域,但是陶瓷基板 銅基板有什么區(qū)別呢...
2023-04-07 http://www.nimazhi.cn/Article/tongjibantaocijibany.html
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[行業(yè)動(dòng)態(tài)]AMB Si3N4 陶瓷基板在高功率半導(dǎo)體器件中的應(yīng)用
2023-03-22 http://www.nimazhi.cn/Article/AMBSi3N4taocijibanza.html
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[行業(yè)動(dòng)態(tài)]制備高導(dǎo)熱氮化硅陶瓷基板的影響因素淺析
2023-03-10 http://www.nimazhi.cn/Article/zhibeigaodaoredanhua.html
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[行業(yè)動(dòng)態(tài)]AMB陶瓷基板在IGBT上的應(yīng)用介紹
2023-03-08 http://www.nimazhi.cn/Article/AMBtaocijibanzaiIGBT.html
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[行業(yè)動(dòng)態(tài)]氮化硅AMB基板:新能源汽車(chē)SiC功率模塊的首選工藝
Si3N4-AMB陶瓷基板熱導(dǎo)率高于90W/mk,厚銅層具有較高熱容量以及傳熱性,同時(shí)AMB工藝可將厚銅金屬(800μm)焊接到相對(duì)較薄的氮化硅陶瓷上,形成高載流能力;
2023-02-27 http://www.nimazhi.cn/Article/danhuaguiAMBjibanxin.html
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[行業(yè)動(dòng)態(tài)]高導(dǎo)熱氮化硅陶瓷基板產(chǎn)業(yè)化進(jìn)展
2023-02-17 http://www.nimazhi.cn/Article/danhuaguitaociban.html